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Direct laser writing and 3D micro-printer: the Dilase range

The Dilase range, equipment for photolithography by direct laser writing consists of 4 different machines: Dilase 250, Dilase 650, Dilase 750 and Dilase 3D.

Direct laser writer Dilase 250 and some examples of applications

Tabletop laser lithography system: Dilase 250

Dilase 250 is a table-top equipment for maskless photolithography by direct laser writing.

Learn more: Dilase 250

It was initially developed to answer the needs of researchers in microfluidics and photonics.

The needs are similar in terms of vector writing mode performance to avoid stitching problems and in terms of depth of focus to write in thick resin layers. It allows writing all sample sizes from 3mm² to 4 inches in diameter and square masks of 5 inches. The writing field is a maximum of 100x100mm².

Standard laser sources and laser beam size available

The direct laser writer Dilase 250 may be equipped with one laser source, choice of either a 375nm laser which emits up to 70mW and a three-source laser at 405nm that can emit up to 50mW, 100mW or 300mW. Being diode lasers, their life-time is extremely long, over 10,000 hours of real use, because they do not require warming up nor cooling down times.

This laser lithography system is equipped with a writing line whose spot size and hence the resolution is to be chosen in the range 1µm – 50µm. A 1µm spot, when installed on a Dilase system, allows to create 1µm micro-structures, and a little bit less.

The specific optical treatment chain, developed by Kloe gets a very large depth of focus

It enables our systems to be compatible with thick layer laser writing, in only one single pass laser without having to adjust the focusing point.

This specific optical treatment lets our systems offer you a unique capacity to produce microstructures with a minimum 20:1 aspect ratio guaranteed. This means that a spot size of 1µm allows writing 1µm linewidth layers as thick as 20µm, and in a similar manner a spot of 10µm in a 200µm thick layer while sidewalls remain perfectly straight and parallel to each other.

Absolute reference

The focusing system is totally mechanical and controlled by the software in the machine. Equipped with an optical encoder few sensitive to T° C and with a 100nm precision on a 25mm maximum travel range, it gives physical absolute reference to the user.

Thanks to this automatic control with an absolute reference and its large depth of focus, the direct laser writing equipment Dilase 250 does not need for an auto-focus system. Consequently, there are no limitations on the sizes of chips to proceed and capability to pattern non flat samples.

Dilase 250 is equipped with X-Y linear tables without friction, which offers 3 writing modes

The standard resolution of the tables is 100nm for each axis. These X and Y stages are dynamically controlled in real time in any direction. Thanks to this, the Dilase direct laser writing systems offer 3 write modes:

  • Standard scanning mode to fill large surface very quickly
  • Vector mode to smooth any contour requiring for minimum roughness nor stitching deffects
  • The combination of both modes by fast filling in scanning mode and the finalizing contours in vector mode to obtain perfectly square pattern edges and without roughness.

The laser lithography system Dilase 250 is also equipped with a realignment system, such as a mask aligner.

The system developed by Kloe is based on a high-resolution video system which allows a high-level precision or realignment to proceed overlay on the complete surface.

See the use-case of our direct laser writer Dilase 250, by CIRIMAT-Toulouse

Multifunction maskless lithography equipment: Dilase 650

Dilase 650 is an integrated and compact maskless direct laser lithography system.

Learn more: Dilase 650

It was originally developed to answer very specific and demanding needs, by Essilor International, in terms of positioning performance and follow-up of very high-speed trajectories and optical large depth of focus.

The overall organs necessary for the functioning of the equipment is integrated in the cover. It is directly mounted on its own anti-vibration support.

It allows writing all sample sizes from 3mm² to 4 inches or 6 inches in diameter (5 or 7 inches for square substrates). The writing field is a maximum of 100x100mm² or 150x150mm².

Standard laser sources and laser beam size available

The laser lithography system Dilase 650 may be equipped with one or two lasers (375 or 405nm) and of 1 or 2 spot sizes. Each of the 2 lasers may be automatically or manually routed in a few seconds from one of the 2 spots sizes. It is thus possible to use the high-resolution spot to write the most demanding patterns of your file, then automatically switch to another lower spot size to write patterns exhibiting less resolution or to fill larger surfaces with high write velocity.

Each standard spot size from 1µm up to 50µm is compatible with the realisation of micro-structure, presenting ratio a minimum 20:1 aspect ratio. This value is in no way a limitation in the capacities of the machine to write in thicker layers.

Absolute referencing

The focusing system equipping the direct laser writing system Dilase 650 is motorised and totally controlled by the software of the machine. It is based on a precise optical encoder of 100nm resolution for a total travel range of 50mm.

Like all the other laser lithography equipment, it enables absolute referencing, which allows the user to find in a few seconds the functioning focusing point for any type substrate.

Dynamic stages controlled in real time enable 3 writing modes: vector, scanning or a combination of both

The laser writer Dilase 650 is equipped with X-Y linear tables with no friction. They allow, like all other direct laser lithography equipment, to write in scanning mode, vector mode or a combination of both writing modes.

The write velocity may be adjusted from a fraction of mm/mn at will or adjusted to several hundred mm/s (or mm2/min) according to the writing mode. The maximum writing velocity, along linear trajectories, may go up to more than 500nm/s, thus offering a very fast production rate.

A design may be divided into as many sub-files as the user wishes. Each sub-file can thus be written with its own writing parameters.

Alignment system

The photolithography equipment Dilase 650 is also equipped of a video assisted repositioning and alignment system. Coaxial to the writing spot, this alignment system works for each optical line and for each writing spot with the same alignment accuracy. Backside alignment function is also available as an option.

See the testimony of Dr Steven Johnson, from York University about our Dilase 650

Maskless equipment Dilase 650 with open window and some examples of applications
Direct laser writer Dilase 750 with open window and one example of application

Customisable direct laser writer: Dilase 750

Dilase 750 is entirely custom-built from the customer specifications.

Learn more: Dilase 750

The writing surface can be adjusted on specifications between 4, 6, 8, 10, 12 inches and more.

This maskless equipment is designed to receive up to 3 laser sources (325nm, 375nm, 405nm) and to manage up to 3 different spot sizes, to choose in a range 0,5µm-50µm. The smallest spot size available being 500nm which even allows to produce micro-structures inferior to 400nm.

Switch automatic

Such an equipment composed of 3 lasers and 3 different spot sizes thus offers up to 9 combinations, all automatically switchable in a few seconds and controlled by the DilaseSoft. These 9 combinations or optical lines all have their own optical paths with fixed optical elements. This reduces to a maximum all risks for misalignment the optical treatment chains, while guaranteeing the utmost performance with the largest flexibility usage.

A wide range of options

The direct laser writer Dilase 750 integrates all mechanical, optical, electronical and software elements necessary to its optimal functioning for your applications. You may select from a wide range of options such as simple or backside alignment, high-resolution writing line, line with a very large depth of focus, circular or square shaped spot, standard or tilted writing line.

High resolution 3D micro-printer: Dilase 3D

Dilase 3D is a very high-resolution 3D printer compatible with the production of large volume objects, up to 100x100x50mm3. This equipment was developed by Kloe from specifications from the CNRS laboratory – LAAS from Toulouse, member of the technological network platform RENATECH.

Learn more: Dilase 3D

This high resolution 3D micro-printer equipment was initially developed to answer the needs from the microfluidic and biotech scientific communities for medical and food applications.

The collaboration with the researchers of CNRS – LAAS from Toulouse has let us to fill the technology gap between:

  • The 3D printing equipment available on the market compatible with the production of large volume objects but with a poor resolution (minimum 100µm) for one part
  • And high-resolution equipment to the scale of tens of nanometres but incompatible with the production of objects with dimensions over a few cubic millimetres

The high resolution 3D printer Dilase 3D offers micro-metric resolutions while still enabling the production of pieces whose volume can be up to 100x100x50mm3.

Standard laser sources and laser beam size available

This laser based stereolithographic system is either equipped with a laser of 375nm (70mW) or a laser of 405nm (50mW or 100mW).

It may be fitted with 1 or 2 spot sizes that are automatically switchable: one micro-metric writing head for high-resolution and another with a large diameter to cover large surfaces at high writing velocities.

Vector or scanning mode both available

The writing is either made in scanning mode or vector write mode to offer the greatest possible flexibility of use to the user.

High depth of focus

The optical lines propose depths of focus which can be adjusted according to the applications, to manufacture suspended structures or structures with cavities, or to adjust the Z-step save processing time or to gain in resolution following this 3rd axis. The Z-step may be adjusted from 1µm to 100µm.

Related applications

Even though Dilase 3D has been initially developed for the 3D microfluidics industry and for applications in biotechnology and biomedical, it also meets expectations from other domains of activity such as surface functionalization or even the MEMS industry.


Today, this 3D microstereolithography equipment is recognised as a unique equipment in the high-resolution stereolithography area.

High resolution 3D printer Dilase 3D and some examples of applications