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Hight resolution 3D printer : DILASE 3D
3D Tabletop printing system
High resolution 3D lithographic laser system, the Dilase 3D offers the possibility to work in 3 dimensions with a resolution of 5µm. It allow to write on all type of substrate (semi-conductor, glass, polymer, cristal, thin film…) on a surface expendable up to 100 x 100 mm, and a thickness of 50mm .
A novel technology
Kloé has developped a new approach in 3D printing through its knowledge in laser photolithography. Kloé offers a high resolution 3D printing tool (<10µm) currently unique on the market. Dilase 3D enables to conceive high resolution objects with a great volume (100 x 100 x 50mm³).
This new equipment has been developped in partnership with LAAS-CNRS Renatech lab. LAAS-CNRS particulary developped the process to realise hight quality 3D microfluidics and biotech devices.
Dilase 3D experience
Great depth of focus
The great depth of focus resulting from the specific optical processing developed by Kloé , allows to write as easely in thick layers as thinner layers with the same verticality of edges and minimal roughness.Therefore, one can save a lof of time in the work process of large object without a quantity loss.
The software suite Dilasesoft and 3DSlicer equip in standard all 3D equipment.
The 3DSlicer is a software allowing to visualize and convert your 3D design files compatible with our equipment. The latter enable not only the importation of STL files which is the standard format in 3D industry, but also to recreate a 3D design with the assistance of monochrome images.
Developed to pilot the lithographic equipment of Dilase range, Dilasesoft is a piloting software that ensures the production of all type of design written by direct laser. The ergonomics and performance have guided the development of this support.
Perfectly adapted, this software suite brings you concrete answers to current demand in microfabrication, from the prototype phase to the full production.
- Linear writing speed : up to 50mm/s
- Address grid : 100nm
- Repeatability : 100nm
- Accepted wafers : 1 to 4 inches
- Accepted substrate thickness : from 250µm to 10mm
- Laser beam width (1 or 2) : from 1µm to 50µm
- Aspect ratio : minimum 10
- Dimensions : 545 x 795 x 853 mm
- Available laser sources : 375nm or 405nm
- Accepted files format : STL
- Motorized focal length
- integrated design software: 3D Slicer and Dilasesoft V.2
- Two wrinting modes : vectorial and scanning.