You are here

Direct write lithography :
UV LED insolation & laser lithography systems

With both the Dilase and UV-KUB equipment, Kloé proposes a complete and top of the range of lithography systems.

The Dilase direct writing laser systems

The equipment from the Dilase range are maskless lithography systems based on direct laser writing. The range consists in the following:

A unique depth of focus for high resolution lithography

The Dilase technology delivers numerous innovations and unique specificities on the market of technologies dedicated to direct photolithography by laser. Notably, the capacity to write in layers of resins of several hundred microns with a single laser sweep, thanks to several optical treatments that guarantee a very large depth of focus.

This large depth of focus, unique in the market of lithography equipment with or without masks, opens the door for high-resolution optic photolithography to numerous applications such as microfluidics, guided optics, surface functionalization and micro-mechanics.

By using these systems, you will benefit from greater flexibility and from better reliability of performances in microelectronics but also in other processes more traditional, users of optic lithography technologies. Finally, thanks to this, there is no need to use auto-focus systems which are very often the source of problems and the technological limitations rather than being value-adding.

Combine the writing in vector mode and scanning mode

The Dilase technology also offers the possibility to write in vector or scanning mode or a combination of both writing modes on one same pattern. It is also possible to modulate the write velocity at will in vector mode as well as in scanning mode. Finally, all Dilase equipment offers a large range of specific write modes ranging from a high aspect ratio microstructuring mode (up to 1X80) to grayscale levels structuration, with unlimited levels of grey, or the writing of micropillars in high density on large surfaces with high rate of writing.

Dilase 3D: stereolithography in 3D

Dilase 3D is a high-resolution stereolithography equipment in 3D to produce large volume objects (100X100X50mm3). This high-resolution 3D printer enables you to create micro-structures at micrometric resolution scale. It was designed in partnership with the CNRS laboratory from LAAS in Toulouse for 3D micro-fluidic, bio-medical and bio-technology applications.

The UV-KUB exposure systems for soft lithography

The equipment in the UV-KUB range is a UV LED based masking photolithography system. The range consists of 4 equipment:

Masker UV-KUB 2

The UV-KUB range proposes masking equipment for soft lithography called UV KUB 2, for use with a 4” or 6” wafer diameter.

This extremely compact LED-based equipment offers a number of comes with a number of advantages:

  • Ease of use, totally controlled by a touch-screen
  • Long life-time from the source to the UV LED
  • The cold UV source prevents negative thermal effects
  • Can be used outside the clean room, thanks to its completely closed configuration
  • Adjustable power emission
  • Choice of continuous isolation or by a series of pulsations where the duration and the power can be adjusted

Mask aligner UV-KUB 3

UV-KUB 3 is the new generation of mask aligner, available for 4” or 6” substrate sizes that integrates all innovative technologies from the last few years controlled by: a UV LED based monochromatic source that needs no warm up or no cool down sequences, touch-screen and CCD cameras of traditional binoculars for the visualisation instead and an easy-to-use joypad, user-friendly for the realisation of the alignment. The on-board PC offers the possibility for image capturing, metrology and above all the recording of the alignment masks coordinates to enable automatic pre-alignment of the two visualising cameras. This compact and enclosed equipment can be used outside of a clean room..

Exposure system UV-KUB 9

UV KUB 9 is a very high-power curing equipment. It is dedicated to wafer bounding or dicing blue tapes curing for wafer as large as up to 8 inches. It is also equipped with a UV LED source, which offers the advantage to not generate thermal effects and to not emit ozone at the sample stage and no ozone emissions