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What are the differences between the two UV-KUB and Dilase systems?

The choice of the UV-KUB range is guided by the decision to use photomasks for lithography processes.

Main advantage: simultaneous and fast production of patterns on the same working surface.

Main disadvantages:

  • Limitations as far as changing designs (design is “frozen” by the photomask configuration)
  • Limited depth of focus and therefore limited usage of the range of photosensitive resin’s thickness. 
  • Resolution limited between 1 and 2µm.

The choice of the Dilase range corresponds to a need to use a tool particularly adapted for fast prototyping at low costs. This is also the need to be able to structure resin thicknesses that may vary from a few hundred nanometres to several hundred macrons with vertical sides in all circumstances.

Main advantages:

  • Maskless Technology, well adapted to fast prototyping and for the development of new functions at minimum costs.
  • Technology of micro-fabrication compatible with the structuration of very thick resins (important depth of focus)
  • Technology of micro-structuration with a very high resolution (<0.5µm)
  • Fabrication of your own photomasks.

Main disadvantage:  the time required for the treatment of a full surface is naturally superior to the one needed by masking.