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What are the differences between the two UV-KUB and Dilase systems?
The choice of the UV-KUB range is guided by the decision to use photomasks for lithography processes.
Main advantage: simultaneous and fast production of patterns on the same working surface.
- Limitations as far as changing designs (design is “frozen” by the photomask configuration)
- Limited depth of focus and therefore limited usage of the range of photosensitive resin’s thickness.
- Resolution limited between 1 and 2µm.
The choice of the Dilase range corresponds to a need to use a tool particularly adapted for fast prototyping at low costs. This is also the need to be able to structure resin thicknesses that may vary from a few hundred nanometres to several hundred macrons with vertical sides in all circumstances.
- Maskless Technology, well adapted to fast prototyping and for the development of new functions at minimum costs.
- Technology of micro-fabrication compatible with the structuration of very thick resins (important depth of focus)
- Technology of micro-structuration with a very high resolution (<0.5µm)
- Fabrication of your own photomasks.
Main disadvantage: the time required for the treatment of a full surface is naturally superior to the one needed by masking.